MICRO-LAM TECHNOLOGIES
BATTLE CREEK, MICHIGAN
The µ-LAM process provides an effective technique for machining nominally hard and brittle semiconductor and ceramic materials, without fracture, through a combination of generating a ductile high pressure phase (via the HPPT) and then heating and thermally softening the transformed material with the laser energy, rendering it more ductile/pliable (plastic) and less brittle. Not only can fracture free surfaces (free of subsurface cracks also) be generated, but other surface and subsurface damage can be minimized or eliminated altogether.
